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? 2004 microchip technology inc. ds21733e-page 1 mcp6001/2/4 features ? available in sc-70-5 and sot-23-5 packages gain bandwidth product: 1 mhz (typ.) rail-to-rail input/output supply voltage: 1.8v to 5.5v supply current: i q = 100 a (typ.) phase margin: 90 (typ.) temperature range: - industrial: -40c to +85c - extended: -40c to +125c available in single, dual and quad packages applications automotive portable equipment photodiode amplifier analog filters notebooks and pdas battery-powered systems available tools spice macro models (at www.microchip.com) filterlab ? software (at www.microchip.com) typical application description the microchip technology inc. mcp6001/2/4 family of operational amplifiers (op amps) is specifically designed for general-purpose applications. this family has a 1 mhz gain bandwidth product (gbwp) and 90 phase margin (typ.). it also maintains 45 phase margin (typ.) with a 500 pf capacitive load. this family operates from a single supply voltage as low as 1.8v, while drawing 100 a (typ.) quiescent current. additionally, the mcp6001/2/4 supports rail-to-rail input and output swing, with a common mode input voltage range of v dd +300mv to v ss ? 300 mv. this family of op amps is designed with microchip?s advanced cmos process. the mcp6001/2/4 family is available in the industrial and extended temperature ranges, with a power supply range of 1.8v to 5.5v. package types r 1 v out r 2 v in v dd + ? gain 1 r 1 r 2 ----- - + = non-inverting amplifier mcp6001 v ref v ss 4 5 4 5 4 mcp6001 1 2 3 - + 5 v dd v in ? v out v ss v in + sc-70-5, sot-23-5 mcp6002 pdip, soic, msop mcp6004 v ina + v ina ? v ss 1 2 3 4 14 13 12 11 - v outa + - + v dd v outd v ind ? v ind + 10 9 8 5 6 7 v outb v inb ? v inb +v inc + v inc ? v outc + - - + pdip, soic, tssop v ina + v ina ? v ss 1 2 3 4 8 7 6 5 - v outa + - + v dd v outb v inb ? v inb + 4 1 2 3 - + 5 v dd v out v ss mcp6001r sot-23-5 1 2 3 - + v ss v in ? v out v dd v in + mcp6001u sot-23-5 1 2 3 - + v dd v out v in + v ss v in ? 1 mhz, low-power op amp
mcp6001/2/4 ds21733e-page 2 ? 2004 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v dd ? v ss ........................................................................7.0v all inputs and outputs ................... v ss ? 0.3v to v dd + 0.3v difference input voltage ...................................... |v dd ? v ss | output short-circuit current .................................continuous current at input pins ....................................................2 ma current at output and supply pins ............................30 ma storage temperature.....................................-65c to +150c maximum junction temperature (t j ) .......................... +150c esd protection on all pins (hbm;mm) ............... 4 kv; 200v ? notice: stresses above those listed under ?maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc electrical specifications electrical characteristics : unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, r l = 10 k ? to v dd /2 and v out v dd /2. parameters sym min typ max units conditions input offset input offset voltage v os -4.5 ? +4.5 mv v cm = v ss (note 1) input offset drift with temperature ? v os / ? t a ?2.0?v/ct a = -40c to +125c, v cm = v ss power supply rejection ratio psrr ? 86 ? db v cm = v ss input bias current and impedance input bias current: i b ?1.0? pa industrial temperature i b ?19?pat a = +85c extended temperature i b ? 1100 ? pa t a = +125c input offset current i os ?1.0? pa common mode input impedance z cm ?10 13 ||6 ? ? ||pf differential input impedance z diff ?10 13 ||3 ? ? ||pf common mode common mode input range v cmr v ss ? 0.3 ? v dd + 0.3 v common mode rejection ratio cmrr 60 76 ? db v cm = -0.3v to 5.3v, v dd = 5v open-loop gain dc open-loop gain (large signal) a ol 88 112 ? db v out = 0.3v to v dd ? 0.3v, v cm =v ss output maximum output voltage swing v ol , v oh v ss + 25 ? v dd ? 25 mv v dd = 5.5v output short-circuit current i sc ?6?mav dd = 1.8v ?23?mav dd = 5.5v power supply supply voltage v dd 1.8 ? 5.5 v quiescent current per amplifier i q 50 100 170 a i o = 0, v dd = 5.5v, v cm = 5v note 1: mcp6001/2/4 parts with date codes prior to december 2004 (week code 49) were tested to 7 mv minimum/ maximum limits.
? 2004 microchip technology inc. ds21733e-page 3 mcp6001/2/4 ac electrical specifications temperature specifications electrical characteristics: unless otherwise indicated, t a = +25c, v dd = +1.8 to 5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2 and c l = 60 pf. parameters sym min typ max units conditions ac response gain bandwidth product gbwp ? 1.0 ? mhz phase margin pm ? 90 ? g = +1 slew rate sr ? 0.6 ? v/s noise input noise voltage e ni ? 6.1 ? vp-p f = 0.1 hz to 10 hz input noise voltage density e ni ?28?nv/ hz f = 1 khz input noise current density i ni ?0.6?fa/ hz f = 1 khz electrical characteristics: unless otherwise indicated, v dd = +1.8v to +5.5v and v ss = gnd. parameters sym min typ max units conditions temperature ranges industrial temperature range t a -40 ? +85 c extended temperature range t a -40 ? +125 c operating temperature range t a -40 ? +125 c note storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5l-sc70 ja ? 331 ? c/w thermal resistance, 5l-sot-23 ja ? 256 ? c/w thermal resistance, 8l-pdip ja ?85?c/w thermal resistance, 8l-soic (150 mil) ja ?163?c/w thermal resistance, 8l-msop ja ?206?c/w thermal resistance, 14l-pdip ja ? 70 ? c/w thermal resistance, 14l-soic ja ? 120 ? c/w thermal resistance, 14l-tssop ja ? 100 ? c/w note: the industrial temperature devices operate over this extended temperature range, but with reduced performance. in any case, the internal junction temperature (t j ) must not exceed the absolute maximum specification of +150c.
mcp6001/2/4 ds21733e-page 4 ? 2004 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2 and c l = 60 pf. figure 2-1: input offset voltage. figure 2-2: psrr, cmrr vs. frequency. figure 2-3: input bias current at +85c. figure 2-4: cmrr, psrr vs. ambient temperature. figure 2-5: open-loop gain, phase vs. frequency. figure 2-6: input bias current at +125c. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0% 2% 4% 6% 8% 10% 12% 14% 16% 18% 20% 5 -4 -3 -2 -1 0 1 2 3 4 5 input offset voltage (mv) percentage of occurrences 64,695 samples v cm = v ss 20 30 40 50 60 70 80 90 100 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency (hz) psrr, cmrr (db) psrr+ cmrr psrr? v cm = v ss 10 100 1k 10k 100k 0% 2% 4% 6% 8% 10% 12% 14% 0 3 6 9 12 15 18 21 24 27 30 input bias current (pa) percentage of occurrences 1230 samples v dd = 5.5v v cm = v dd t a = +85c 70 75 80 85 90 95 100 -50 -25 0 25 50 75 100 125 ambient temperature (c) psrr, cmrr (db) psrr (v cm = v ss ) cmrr (v cm = -0.3v to +5.3v) -20 0 20 40 60 80 100 120 1.e- 01 1.e +00 1.e +01 1.e +02 1.e +03 1.e +04 1.e +05 1.e +06 1.e +07 frequency (hz) open-loop gain (db) -210 -180 -150 -120 -90 -60 -30 0 open-loop phase () 0.1 1 10 100 10k 100k 1m 10m phase gain 1k v cm = v ss 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% 55% 0 150 300 450 600 750 900 1050 1200 1350 1500 input bias current (pa) percentage of occurrences 605 samples v dd = 5.5v v cm = v dd t a = +125c
? 2004 microchip technology inc. ds21733e-page 5 mcp6001/2/4 note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2 and c l = 60 pf. figure 2-7: input noise voltage density vs. frequency. figure 2-8: input offset voltage vs. common mode input voltage at v dd = 1.8v. figure 2-9: input offset voltage vs. common mode input voltage at v dd = 5.5v. figure 2-10: input offset voltage drift. figure 2-11: input offset voltage vs. output voltage. figure 2-12: output short-circuit current vs. power supply voltage. 10 100 1,000 1.e-01 1.e+0 0 1.e+0 1 1.e+0 2 1.e+0 3 1.e+0 4 1.e+0 5 frequency (hz) input noise voltage density (nv/ ? hz) 0.1 10 1 100 10k 1k 100k -700 -600 -500 -400 -300 -200 -100 0 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 common mode input voltage (v) input offset voltage (v) v dd = 1.8v t a = -40c t a = +25c t a = +85c t a = +125c -700 -600 -500 -400 -300 -200 -100 0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 common mode input voltage (v) input offset voltage (v) v dd = 5.5v t a = -40c t a = +25c t a = +85c t a = +125c 0% 2% 4% 6% 8% 10% 12% 14% 16% 18% -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 input offset voltage drift (v/c) percentage of occurrences 1225 samples t a = -40c to +125c v cm = v ss -200 -150 -100 -50 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 output voltage (v) input offset voltage (v) v dd = 1.8v v cm = v ss v dd = 5.5v 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) short circuit current magnitude (ma) t a = -40c t a = +25c t a = +85c t a = +125c
mcp6001/2/4 ds21733e-page 6 ? 2004 microchip technology inc. note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2 and c l = 60 pf. figure 2-13: slew rate vs. ambient temperature. figure 2-14: output voltage headroom vs. output current magnitude. figure 2-15: output voltage swing vs. frequency. figure 2-16: small-signal, non-inverting pulse response. figure 2-17: large-signal, non-inverting pulse response. figure 2-18: quiescent current vs. power supply voltage. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 125 ambient temperature (c) slew rate (v/s) falling edge, v dd = 5.5v rising edge, v dd = 5.5v rising edge, v dd = 1.8v falling edge, v dd = 1.8v 1 10 100 1,000 1.e-05 1.e-04 1.e-03 1.e-02 output current magnitude (a) output voltage headroom (mv) v dd ? v oh 10 10m 1m 100 v ol ? v ss 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 frequency (hz) output voltage swing (v p-p ) v dd = 5.5v 1k 10k 100k 1m v dd = 1.8v -0.08 -0.06 -0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.e+0 0 1.e-06 2.e-0 6 3.e-0 6 4 .e-06 5.e- 06 6.e-0 6 7 .e-06 8.e- 06 9.e-06 1.e-05 time (1 s/div) output voltage (20 mv/div) g = +1 v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.e+00 1 .e-05 2.e-0 5 3 .e-05 4.e-0 5 5 .e-05 6.e-05 7.e-0 5 8.e-05 9.e-0 5 1.e-04 time (10 s/div) output voltage (v) g = +1 v/v v dd = 5.0v 0 20 40 60 80 100 120 140 160 180 0.00.51.01.52.02.53.03.54.04.55.05.5 power supply voltage (v) quiescent current per amplifier (a) v cm = v dd - 0.5v t a = +125c t a = +85c t a = +25c t a = -40c
? 2004 microchip technology inc. ds21733e-page 7 mcp6001/2/4 3.0 pin descriptions descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 analog outputs the output pins are low-impedance voltage sources. 3.2 analog inputs the non-inverting and inverting inputs are high- impedance cmos inputs with low bias currents. 3.3 power supply (v ss and v dd ) the positive power supply (v dd ) is 1.8v to 5.5v higher than the negative power supply (v ss ). for normal operation, the other pins are at voltages between v ss and v dd . typically, these parts are used in a single (positive) supply configuration. in this case, v ss is connected to ground and v dd is connected to the supply. v dd will need a local bypass capacitor (typically 0.01 f to 0.1 f) within 2 mm of the v dd pin. these parts can share a bulk capacitor with analog parts (typically 2.2 f to 10 f) within 100 mm of the v dd pin. mcp6001 mcp6001r mcp6001u mcp6002 mcp6004 symbol description 11411v out , v outa analog output (op amp a) 44322v in ?, v ina ? inverting input (op amp a) 33133v in +, v ina + non-inverting input (op amp a) 52584v dd positive power supply ??? 5 5v inb + non-inverting input (op amp b) ??? 6 6 v inb ? inverting input (op amp b) ??? 7 7v outb analog output (op amp b) ???? 8v outc analog output (op amp c) ???? 9v inc ? inverting input (op amp c) ????10v inc + non-inverting input (op amp c) 252411v ss negative power supply ????12v ind + non-inverting input (op amp d) ????13v ind ? inverting input (op amp d) ????14v outd analog output (op amp d)
mcp6001/2/4 ds21733e-page 8 ? 2004 microchip technology inc. 4.0 application information the mcp6001/2/4 family of op amps is manufactured using microchip?s state-of-the-art cmos process and is specifically designed for low-cost, low-power and general-purpose applications. the low supply voltage, low quiescent current and wide bandwidth makes the mcp6001/2/4 ideal for battery-powered applications. this device has high phase margin, which makes it stable for larger capacitive load applications. 4.1 rail-to-rail input the mcp6001/2/4 op amps are designed to prevent phase reversal when the input pins exceed the supply voltages. figure 4-1 shows the input voltage exceeding the supply voltage without any phase reversal. figure 4-1: the mcp6001/2/4 show no phase reversal. the input stage of the mcp6001/2/4 op amps use two differential input stages in parallel. one operates at a low common mode input voltage (v cm ), while the other operates at a high v cm . with this topology, the device operates with a v cm up to 300 mv above v dd and 300 mv below v ss . the input offset voltage is measured at v cm =v ss ? 300 mv and v dd +300mv to ensure proper operation. input voltages that exceed the input voltage range (v ss ? 0.3v to v dd + 0.3v at 25c) can cause excessive current to flow into or out of the input pins, while current beyond 2 ma can cause reliability problems. applications that exceed this rating must be externally limited with a resistor, as shown in figure 4-2. figure 4-2: input current limiting resistor (r in ). 4.2 rail-to-rail output the output voltage range of the mcp6001/2/4 op amps is v dd ?25mv (min.) and v ss + 25 mv (max.) when r l =10k ? is connected to v dd /2 and v dd = 5.5v. refer to figure 2-14 for more information. 4.3 capacitive loads driving large capacitive loads can cause stability prob- lems for voltage feedback op amps. as the load capac- itance increases, the feedback loop?s phase margin decreases and the closed-loop bandwidth is reduced. this produces gain peaking in the frequency response, with overshoot and ringing in the step response. while a unity-gain buffer (g = +1) is the most sensitive to capacitive loads, all gains show the same general behavior. when driving large capacitive loads with these op amps (e.g., > 100 pf when g = +1), a small series resistor at the output (r iso in figure 4-3) improves the feedback loop?s phase margin (stability) by making the output load resistive at higher frequencies. the band- width will be generally lower than the bandwidth with no capacitance load. figure 4-3: output resistor, r iso stabilizes large capacitive loads. -1 0 1 2 3 4 5 6 0.e+00 1 .e-05 2.e-0 5 3 .e-05 4.e-05 5.e-05 6.e-0 5 7.e- 05 8.e-05 9 .e-05 1.e-04 time (10 s/div) input, output voltages (v) v dd = 5.0v g = +2 v/v v in v out r in v ss minimum expected v in () ? 2 ma --------------------------------------------------------------------------- - r in maximum expected v in () v dd ? 2 ma ------------------------------------------------------------------------------ - v in r in v out mcp600x ? + v in r iso v out mcp600x c l ? +
? 2004 microchip technology inc. ds21733e-page 9 mcp6001/2/4 figure 4-4 gives recommended r iso values for different capacitive loads and gains. the x-axis is the normalized load capacitance (c l /g n ), where g n is the circuit's noise gain. for non-inverting gains, g n and the signal gain are equal. for inverting gains, g n is 1+|signal gain| (e.g., -1 v/v gives g n = +2 v/v). figure 4-4: recommended r iso values for capacitive loads. after selecting r iso for your circuit, double-check the resulting frequency response peaking and step response overshoot. modify r iso ?s value until the response is reasonable. bench evaluation and simula- tions with the mcp6001/2/4 spice macro model are very helpful. 4.4 supply bypass with this family of operational amplifiers, the power supply pin (v dd for single-supply) should have a local bypass capacitor (i.e., 0.01 f to 0.1 f) within 2 mm for good high-frequency performance. it also needs a bulk capacitor (i.e., 1 f or larger) within 100 mm to provide large, slow currents. this bulk capacitor can be shared with other analog parts. 4.5 pcb surface leakage in applications where low input bias current is critical, printed circuit board (pcb) surface leakage effects need to be considered. surface leakage is caused by humidity, dust or other contamination on the board. under low humidity conditions, a typical resistance between nearby traces is 10 12 ? . a 5v difference would cause 5 pa of current to flow; which is greater than the mcp6001/2/4 family?s bias current at 25c (1 pa, typ.). the easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). the guard ring is biased at the same voltage as the sensitive pin. an example of this type of layout is shown in figure 4-5. figure 4-5: example guard ring layout for inverting gain. 1. non-inverting gain and unity-gain buffer: a. connect the non-inverting pin (v in +) to the input with a wire that does not touch the pcb surface. b. connect the guard ring to the inverting input pin (v in ?). this biases the guard ring to the common mode input voltage. 2. inverting gain and transimpedance gain amplifiers (convert current to voltage, such as photo detectors): a. connect the guard ring to the non-inverting input pin (v in +). this biases the guard ring to the same reference voltage as the op amp (e.g., v dd /2 or ground). b. connect the inverting pin (v in ?) to the input with a wire that does not touch the pcb surface. 10 100 1000 1.e-11 1.e-10 1.e-09 1.e-08 normalized load capacitance; c l /g n (f) recommended r iso ( : ) g n = 1 g n t 2 v dd = 5.0v r l = 100 k : 10p 10n 100p 1n 10n guard ring v ss v in -v in +
mcp6001/2/4 ds21733e-page 10 ? 2004 microchip technology inc. 4.6 application circuits 4.6.1 unity-gain buffer the rail-to-rail input and output capability of the mcp6001/2/4 op amp is ideal for unity-gain buffer applications. the low quiescent current and wide bandwidth makes the device suitable for a buffer configuration in an instrumentation amplifier circuit, as shown in figure 4-6. figure 4-6: instrumentation amplifier with unity-gain buffer inputs. 4.6.2 active low-pass filter the mcp6001/2/4 op amp?s low input bias current makes it possible for the designer to use larger resis- tors and smaller capacitors for active low-pass filter applications. however, as the resistance increases, the noise generated also increases. parasitic capacitances and the large value resistors could also modify the fre- quency response. these trade-offs need to be considered when selecting circuit elements. usually, the op amp bandwidth is 100x the filter cutoff frequency (or higher) for good performance. it is possi- ble to have the op amp bandwidth 10x higher than the cutoff frequency, thus having a design that is more sensitive to component tolerances. figure 4-7 shows a second-order butterworth filter with 100 khz cutoff frequency and a gain of +1 v/v; the op amp bandwidth is only 10x higher than the cutoff frequency. the component values were selected using microchip?s filterlab ? software. figure 4-7: active second-order low- pass filter. 4.6.3 peak detector the mcp6001/2/4 op amp has a high input impedance, rail-to-rail input/output and low input bias current, which makes this device suitable for peak detector applica- tions. figure 4-8 shows a peak detector circuit with clear and sample switches. the peak-detection cycle uses a clock (clk), as shown in figure 4-8. at the rising edge of clk, sample switch closes to begin sampling. the peak voltage stored on c 1 is sam- pled to c 2 for a sample time defined by t samp . at the end of the sample time (falling edge of sample signal), clear signal goes high and closes the clear switch. when the clear switch closes, c 1 discharges through r 1 for a time defined by t clear . at the end of the clear time (falling edge of clear signal), op amp a begins to store the peak value of v in on c 1 for a time defined by t detect . in order to define t samp and t clear , it is necessary to determine the capacitor charging and discharging period. the capacitor charging time is limited by the amplifier source current, while the discharging time ( ) is defined using r 1 ( = r 1 c 1 ). t detect is the time that the input signal is sampled on c 1 and is dependent on the input voltage change frequency. the op amp output current limit, and the size of the storage capacitors (both c 1 and c 2 ), could create slew- ing limitations as the input voltage (v in ) increases. current through a capacitor is dependent on the size of the capacitor and the rate of voltage change. from this relationship, the rate of voltage change or the slew rate can be determined. for example, with an op amp short- circuit current of i sc = 25 ma and a load capacitor of c 1 = 0.1 f, then: equation 4-1: v in1 r 2 mcp6002 v in2 r 2 mcp6002 v ref mcp6001 v out r 1 r 1 ? + ? + ? + 1/2 1/2 v out v in2 v in1 ? () r 1 r 2 ----- - ? v ref + = r 1 = 20 k ? r 2 = 10 k ? 14.3 k ? mcp6002 v out 53.6 k ? 100 pf v in 33 pf + ? dv c1 dt ------------ - i sc c 1 ------- - = 25ma 0.1 f -------------- - = dv c1 dt ------------ - 250mv s ? = i sc c 1 dv c1 dt ------------ - =
? 2004 microchip technology inc. ds21733e-page 11 mcp6001/2/4 this voltage rate of change is less than the mcp6001/2/4 slew rate of 0.6 v/s. when the input voltage swings below the voltage across c 1 , d 1 becomes reverse- biased. this opens the feedback loop and rails the amplifier. when the input voltage increases, the amplifier recovers at its slew rate. based on the rate of voltage change shown in the above equation, it takes an extended period of time to charge a 0.1 f capacitor. the capacitors need to be selected so that the circuit is not limited by the amplifier slew rate. therefore, the capaci- tors should be less than 40 f and a stabilizing resistor (r iso ) needs to be properly selected. (refer to section 4.3 ?capacitive loads? ). figure 4-8: peak detector with clear and sample cmos analog switches. v in mcp6002 v c1 mcp6002 d 1 op amp a op amp b v out mcp6001 op amp c c 2 sample signal clear signal clear r iso sample ? + ? + ? + clk t samp t clear t detect switch switch 1/2 1/2 r 1 r iso v c2 c 1
mcp6001/2/4 ds21733e-page 12 ? 2004 microchip technology inc. 5.0 design tools microchip provides the basic design tools needed for the mcp6001/2/4 family of op amps. 5.1 spice macro model the latest spice macro model for the mcp6001/2/4 op amps is available on our web site at www.microchip.com. this model is intended to be an initial design tool that works well in the op amp?s linear region of operation at room temperature. see the model file for information on its capabilities. bench testing is a very important part of any design and cannot be replaced with simulations. also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristic curves. 5.2 filterlab ? software microchip?s filterlab ? software is an innovative software tool that simplifies analog active filter (using op amps) design. available at no cost from our web site at www.microchip.com, the filterlab design tool provides full schematic diagrams of the filter circuit with component values. it also outputs the filter circuit in spice format, which can be used with the macro model to simulate actual filter performance.
? 2004 microchip technology inc. ds21733e-page 13 mcp6001/2/4 6.0 packaging information 6.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard marking consists of microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). for marking beyond this, certain price adders apply. please check with your microchip sales office. mcp6002 i/p256 0432 mcp6002 i/sn0432 256 5-lead sc-70 ( mcp6001 ) example: (i-temp) 1 23 5 4 5-lead sot-23 ( mcp6001/1r/1u ) example: (e-temp) xxnn 1 23 5 4 cd25 xxn (front) yww (back) an7 (front) 432 (back) 8-lead msop example: xxxxxx ywwnnn 6002i 432256 device i-temp code e-temp code mcp6001 aann cdnn mcp6001r adnn cenn mcp6001u afnn cfnn note: applies to 5-lead sot-23. device i-temp code e-temp code mcp6001 ann cdn note: applies to 5-lead sc-70.
mcp6001/2/4 ds21733e-page 14 ? 2004 microchip technology inc. package marking information (continued) 14-lead pdip (300 mil) ( mcp6004 )example: 14-lead tssop ( mcp6004 ) example: 14-lead soic (150 mil) ( mcp6004 ) example: xxxxxxxxxxxxxx xxxxxxxxxxxxxx yywwnnn xxxxxxxxxx yywwnnn xxxxxx yyww nnn mcp6004 -i/p 0432256 6004 st 0432 256 xxxxxxxxxx mcp6004 isl 0432256
? 2004 microchip technology inc. ds21733e-page 15 mcp6001/2/4 5-lead plastic package (sc-70) 0.30 0.15 .012 .006 b lead width 0.18 0.10 .007 .004 c lead thickness 0.30 0.10 .012 .004 l foot length 2.20 1.80 .087 .071 d overall length 1.35 1.15 .053 .045 e1 molded package width 2.40 1.80 .094 .071 e overall width 0.10 0.00 .004 .000 a1 standoff 1.00 0.80 .039 .031 a2 molded package thickness 1.10 0.80 .043 .031 a overall height 0.65 (bsc) .026 (bsc) p pitch 5 5 n number of pins max nom min max nom min dimension limits millimeters* inches units exceed .005" (0.127mm) per side. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not notes: jeita (eiaj) standard: sc-70 drawing no. c04-061 *controlling parameter l e1 e c d 1 b p a2 a1 a q1 top of molded pkg to lead shoulder q1 .004 .016 0.10 0.40 n
mcp6001/2/4 ds21733e-page 16 ? 2004 microchip technology inc. 5-lead plastic small outline transistor (ot) (sot23) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.50 0.43 0.35 .020 .017 .014 b lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 10 5 0 10 5 0 foot angle 0.55 0.45 0.35 .022 .018 .014 l foot length 3.10 2.95 2.80 .122 .116 .110 d overall length 1.75 1.63 1.50 .069 .064 .059 e1 molded package width 3.00 2.80 2.60 .118 .110 .102 e overall width 0.15 0.08 0.00 .006 .003 .000 a1 standoff 1.30 1.10 0.90 .051 .043 .035 a2 molded package thickness 1.45 1.18 0.90 .057 .046 .035 a overall height 1.90 .075 p1 outside lead pitch (basic) 0.95 .038 p pitch 5 5 n number of pins max nom min max nom min dimension limits millimeters inches* units 1 p d b n e e1 l c a2 a a1 p1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: mo-178 drawing no. c04-091 significant characteristic
? 2004 microchip technology inc. ds21733e-page 17 mcp6001/2/4 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
mcp6001/2/4 ds21733e-page 18 ? 2004 microchip technology inc. 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2004 microchip technology inc. ds21733e-page 19 mcp6001/2/4 8-lead plastic micro small outline package (ms) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref - - .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - -
mcp6001/2/4 ds21733e-page 20 ? 2004 microchip technology inc. 14-lead plastic dual in-line (p) ? 300 mil (pdip) e1 n d 1 2 eb e c a a1 b b1 l a2 p units inches* millimeters dimension limits min nom max min nom max number of pins n 14 14 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .740 .750 .760 18.80 19.05 19.30 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 5 10 15 5 10 15 mold draft angle bottom * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-001 drawing no. c04-005 significant characteristic
? 2004 microchip technology inc. ds21733e-page 21 mcp6001/2/4 14-lead plastic small outline (sl) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 8.81 8.69 8.56 .347 .342 .337 d overall length 3.99 3.90 3.81 .157 .154 .150 e1 molded package width 6.20 5.99 5.79 .244 .236 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 14 14 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d p n b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-065 significant characteristic
mcp6001/2/4 ds21733e-page 22 ? 2004 microchip technology inc. 14-lead plastic thin shrink small outline (st) ? 4.4 mm (tssop) 8 4 0 8 4 0 foot angle 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.30 0.25 0.19 .012 .010 .007 b1 lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 0.70 0.60 0.50 .028 .024 .020 l foot length 5.10 5.00 4.90 .201 .197 .193 d molded package length 4.50 4.40 4.30 .177 .173 .169 e1 molded package width 6.50 6.38 6.25 .256 .251 .246 e overall width 0.15 0.10 0.05 .006 .004 .002 a1 standoff 0.95 0.90 0.85 .037 .035 .033 a2 molded package thickness 1.10 .043 a overall height 0.65 .026 p pitch 14 14 n number of pins max nom min max nom min dimension limits millimeters* inches units l c 2 1 d n b p e1 e a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .005? (0.127mm) per side. jedec equivalent: mo-153 drawing no. c04-087 significant characteristic
? 2004 microchip technology inc. ds21733e-page 23 mcp6001/2/4 appendix a: revision history revision a (june 2002) original data sheet release. revision b (october 2002) revision c (december 2002) revision d (may 2003) revision e (december 2004) the following is the list of modifications: 1. v os specification reduced to 4.5 mv from 7.0 mv for parts starting with date code yyww = 0449 2. corrected package markings in section 6.0 ?packaging information? 3. added appendix a: revision history.
mcp6001/2/4 ds21733e-page 24 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21733e-page 25 mcp6001/2/4 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support part no. x /xx package temperature range device device: mcp6001t: single op amp (tape and reel) (sc-70, sot-23) mcp6001rt: single op amp (tape and reel) (sot-23) mcp6001ut: single op amp (tape and reel) (sot-23) mcp6002: dual op amp mcp6002t: dual op amp (tape and reel) (soic, msop) mcp6004: quad op amp mcp6004t: quad op amp (tape and reel) (soic, msop) temperature range: i = -40c to +85c e = -40c to +125c package: lt = plastic package (sc-70), 5-lead (mcp6001 only) ot = plastic small outline transistor (sot-23), 5-lead (mcp6001, mcp6001r, mcp6001u) ms = plastic msop, 8-lead p = plastic dip (300 mil body), 8-lead, 14-lead sn = plastic soic, (150 mil body), 8-lead sl = plastic soic (150 mil body), 14-lead st = plastic tssop (4.4mm body), 14-lead examples: a) mcp6001t-i/lt: tape and reel, industrial temperature, 5ld sc-70 package b) mcp6001t-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. c) mcp6001rt-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. d) mcp6001ut-e/ot: tape and reel, extended temperature, 5ld sot-23 package. a) mcp6002-i/ms: industrial temperature, 8ld msop package. b) mcp6002-i/p: industrial temperature, 8ld pdip package. c) mcp6002-e/p: extended temperature, 8ld pdip package. d) mcp6002-i/sn: industrial temperature, 8ld soic package. e) mcp6002t-i/ms: tape and reel, industrial temperature, 8ld msop package. a) mcp6004-i/p: industrial temperature, 14ld pdip package. b) mcp6004-i/sl: industrial temperature,, 14ld soic package. c) mcp6004-e/sl: extended temperature,, 14ld soic package. d) mcp6004-i/st: industrial temperature, 14ld tssop package. e) mcp6004t-i/sl: tape and reel, industrial temperature, 14ld soic package. f) mcp6004t-i/st: tape and reel, industrial temperature, 14ld tssop package. data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com) to receive the most current information on our products.
mcp6001/2/4 ds21733e-page 26 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21733e-page 27 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. microchip makes no representations or war- ranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, migratable memory, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel and total endurance ar e trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2004, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
ds21733e-page 28 ? 2004 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta alpharetta, ga tel: 770-640-0034 fax: 770-640-0307 boston westford, ma tel: 978-692-3848 fax: 978-692-3821 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 san jose mountain view, ca tel: 650-215-1444 fax: 650-961-0286 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8676-6200 fax: 86-28-8676-6599 china - fuzhou tel: 86-591-8750-3506 fax: 86-591-8750-3521 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - shunde tel: 86-757-2839-5507 fax: 86-757-2839-5571 china - qingdao tel: 86-532-502-7355 fax: 86-532-502-7205 asia/pacific india - bangalore tel: 91-80-2229-0061 fax: 91-80-2229-0062 india - new delhi tel: 91-11-5160-8631 fax: 91-11-5160-8632 japan - kanagawa tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 taiwan - hsinchu tel: 886-3-572-9526 fax: 886-3-572-6459 europe austria - weis tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark - ballerup tel: 45-4450-2828 fax: 45-4485-2829 france - massy tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - ismaning tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 england - berkshire tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 10/20/04

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